Automated Surfactant Control System for DISCO (DFD6340)

In semiconductor manufacturing, products are going through different production line before it will be delivered, such of these are the pre-assembly line, front-line, and the back end of line. Wafer dicing process is a part of the so-called pre-assembly line where in production starts with the wafer testing which includes testing and binning of transistor semiconductor, and dicing saw process which is used to sliced semiconductor wafer into an individual chip. Disco DFD6340 is an automatic dicing saw machine that employs high-speed spindle fitted with an extremely thin diamond blade to cut silicon wafer with a high degree of accuracy. To acquire optimum and quality products results, machine must able to comply with both process and equipment requirements from controlled process parameters down to equipment facility specification one of which is the ratio and proportion of the surfactant cleaning agent combining with the D.I water. This research will showcase how surfactant cleaning agent as production material wasted and how it will be reduced through the design prototype project.